The Atomic Layer Deposition is a process that deposits materials using chemical surface reactions that stop automatically when the surface is saturated. This natural stop point prevents buildup and inconsistency. The films are grown one step at a time, making ALD one of the most accurate thin-film technologies available. ALD is most effective when applied to surfaces that require deep coverage without surface damage.

Because ALD works through cycles, thickness can be controlled with high accuracy. The films created are smooth, cohesive, and without holes. The process supports protective layers, insulating films, chemical resistance coatings, and moisture blocking films. ALD films can also be engineered to improve electrical behavior, light transmission, or surface durability depending on the precursor gas combination used. ALD continues to become essential as products get smaller and require flawless film quality.